产品名称	版本	大小	日期

XA Spartan-3E 汽车 FPGA 系列数据手册 (PDF) 查看文档详情 XA Spartan™-3E 系列 FPGA 是专门为满足大批量、成本敏感型汽车电子应用而设计的。该系列的 5 个成员提供的密度范围为 100,000 到 1,600,000 个系统门。有帮助？是 \| 否	1.0	662 KB	2007/08/31
XA Spartan-3A 汽车 FPGA 系列数据手册 (PDF) 查看文档详情 XA Spartan®-3A 系列现场可编程门阵列（FPGA）解决了大多数大批量、成本敏感型、I/O 密集型汽车电子应用的设计挑战。有帮助？是 \| 否	1.0	1.38 MB	2008/04/30
Spartan-3 汽车 XA FPGA 系列：简介和订购 (PDF) 查看文档详情 Xilinx 汽车 (XA) Spartan™-3 系列现场可编程门阵列满足了大容量、成本敏感型汽车电子应用的需求。该系列的 5 个成员提供容量范围从 50,000 到 1,500,000 个系统门。有帮助？是 \| 否	1.2.3	229 KB	2008/01/25
XA Spartan-3A DSP Automotive FPGA Family Data Sheet (PDF) 查看文档详情 The XA Spartan®-3A DSP family of FPGAs solves the design challenges in most high-volume, cost-sensitive, high-performance DSP automotive applications. The XA Spartan-3A DSP family includes hardened DSP MACs with pre-adders, providing significant increases in the throughput and performance of this low-cost family. 有帮助？是 \| 否	1.0	1.26 MB	2008/07/10

产品名称	版本	大小	日期

XCN08017 - Additional Mold Compound Qualification for Automotive BGA Packages (PDF) 查看文档详情 The purpose of this notice is to announce the qualification of an additional mold compound for selected wirebond BGA packages. 有帮助？是 \| 否	1.1	67 KB	2008/07/07
XCN08017 - Additional Mold Compound Qualification for Automotive BGA Packages (PDF) 查看文档详情 The purpose of this notice is to announce the qualification of an additional mold compound for selected wirebond BGA packages. 有帮助？是 \| 否	1.1	67 KB	2008/07/07
XCN08017 - Additional Mold Compound Qualification for Automotive BGA Packages (PDF) 查看文档详情 The purpose of this notice is to announce the qualification of an additional mold compound for selected wirebond BGA packages. 有帮助？是 \| 否	1.1	67 KB	2008/07/07

汽车 XA 器件