XCN08022 - Product Discontinuation Notice For Development Systems Products (PDF)
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The purpose of this notification is to communicate that Xilinx is discontinuing certain Development Systems Products. Was this document helpful? Yes | No
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2.0 |
58 KB |
01/12/2009 |
Spartan-6 - ISE 11.3 Update Software Known Issues related to the Spartan-6 Family
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Keywords: ISE, 11.2, Update, Spartan-6, known, issues
This Answer Record describes the known issues for the Spartan-6 FPGA generation used with the ISE 11.3 Design Suite software. Was this document helpful? Yes | No
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NA |
NA |
09/14/2009 |
XCN09015 - ISE Design Suite and LogiCORE IP Product Discontinuation Notice (PDF)
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To inform you of changes in relation to part numbers used to order Xilinx® ISE® Design Suite software and fee-based LogiCORE™ IP cores. Was this document helpful? Yes | No
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2.0 |
249 KB |
05/04/2009 |
XCN07017 - Xilinx 倒装片产品的组装供应商和材料变更 (PDF)
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本通知的目的是宣布新的第二源制造材料的技术指标,以及 Xilinx 塑料倒装片产品新增的第二源材料供应商。并且,还分步介绍了选定的 Virtex™-4 FX 产品的掩模组。
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1.0 |
126 KB |
08/31/2007 |
PCN00003 - 所有散热增强型 BGA 封装晶片附着材料的变更 (PDF)
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1.0 |
20 KB |
08/03/2000 |
PCN2003-11 - 转换为环保材料(模型混合物和晶片附属材料) (PDF)
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1.1 |
72 KB |
12/06/2004 |
PDN99004 - Xilinx 各产品系列的晶片和晶圆停售 (PDF)
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1.0 |
24 KB |
07/01/1999 |
报告 2002-02 - PDN 政策变更 (PDF)
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1.0 |
19 KB |
03/08/2002 |
XCN07015 - Platform Flash TSOP48 封装的组装地点和 Mold Compound 的变更 (PDF)
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本通知介绍了 ST Microelectronics 制造的 Xilinx 在系统可编程配置 PROM 的 8-Mbit、16-Mbit 和 32-Mbit Platform Flash 器件的2个变更:变更了所有 TSOP48 封装的组装和精加工工厂地点,并统一了模型的组成材料来保证所有的 TSOP48 封装使用相同的 mold compound。 Was this document helpful? Yes | No
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1.0.1 |
190 KB |
09/07/2007 |
XCU2001-02 - XC17V16 和 XC17V08 的新型 Xilinx HW-130 编程器适配器 (PDF)
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1.0 |
20 KB |
03/29/2002 |
Xilinx PDN2003-02 - HardWire 产品停产 (PDF)
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01 |
45 KB |
02/01/2003 |
PDN2000-05 - 某些 HardWire 1 产品停产 (PDF)
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1.0 |
18 KB |
09/28/2000 |
报告 2003-02 - BGA 运输托盘变更 (PDF)
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1.0 |
43 KB |
08/19/2003 |
PCN2004-28 - 湿度指示器卡 (HIC) 变更 (PDF)
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1.0 |
161 KB |
12/06/2004 |
XCN07012 - 许可证牌号 (LPN) 添加至所有的客户标签上 (PDF)
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Xilinx 正在世界各地的各个内部仓库中实施仓库管理系统 (WMS)。因此,自 2007 年 8 月起,许可证牌号 (LPN),即唯一跟踪号码,会标示在标签上。产品的形状、尺寸或功能没有变化。 Was this document helpful? Yes | No
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1.0 |
164 KB |
07/16/2007 |
XCN07002 - 某些军用及抗辐射器件停产 (PDF)
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1.0 |
41 KB |
02/19/2007 |
XCN06021 - XQVR300 和 XQVR600 QPro V 级 FPGA 测试设备中的变动 (PDF)
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1.0 |
35 KB |
10/23/2006 |
XCN05019 - 用于军用产品的模塑料和附晶环氧树脂材料 (PDF)
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模塑料和附晶材料逐渐成为符合ROHS的产品所使用的同一材料。 符合ROHS的材料不含卤素,符合单位JEDEC标准J-STD-020C的湿度灵敏性级别(MSL)3,并且满足UL94 V-0可燃性要求。 组装材料的变化不影响器件的匹配度和功能。 Was this document helpful? Yes | No
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1.0 |
157 KB |
10/24/2005 |
PDN97008A - XC7000 产品系列停产 (PDF)
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1.0 |
18 KB |
04/15/1998 |
PDN97008 - XC7000 产品系列停产 (PDF)
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1.0 |
23 KB |
08/01/1997 |
PCN96010 - XC2000 产品系列停产 (PDF)
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1.0 |
18 KB |
12/20/1996 |
PCN96007 - XC8100 Antifuse 生产线停产 (PDF)
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1.0 |
19 KB |
04/09/1996 |
PCN96006 - XC73144 PQ160:Cin 参数变更 (PDF)
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1.0 |
23 KB |
07/16/1996 |
PCN96002A - 在 tsmc 制造设备的 XC7300 CPLD 系列产品有效期延长 (PDF)
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1.0 |
23 KB |
07/03/1996 |
PCN96002 - Seiko Epson 用作 XC7300 制造设备的资格 (PDF)
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1.0 |
36 KB |
04/02/1996 |
PCN95005 - Xilinx XC7000 制造工艺改进变更 (PDF)
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1.0 |
20 KB |
08/10/1995 |
XCN06002 -停止使用某些军用及抗辐射器件 (PDF)
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1.0 |
52 KB |
01/30/2006 |
PCN98003 - Xilinx XC9500 产品系列将在 UMC 以 0.5μM Flash 工艺制造 (PDF)
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|
1.0 |
24 KB |
07/24/1998 |
XCN07015 - Platform Flash TSOP48 封装的组装地点和 Mold Compound 的变更 (PDF)
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本通知介绍了 ST Microelectronics 制造的 Xilinx 在系统可编程配置 PROM 的 8-Mbit、16-Mbit 和 32-Mbit Platform Flash 器件的2个变更:变更了所有 TSOP48 封装的组装和精加工工厂地点,并统一了模型的组成材料来保证所有的 TSOP48 封装使用相同的 mold compound。 Was this document helpful? Yes | No
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1.0.1 |
190 KB |
09/07/2007 |
XCN07021 - Data Sheet Pin-to-Pin Specification Change for the Virtex-5 Family (PDF)
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The purpose of this notification is to communicate a data sheet pin-to-pin specification change for the Virtex™-5 family. Was this document helpful? Yes | No
|
1.0 |
45 KB |
12/24/2007 |
XCN07022 - Product Discontinuation Notice (PDF)
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Xilinx is discontinuing certain Spartan®, XC4000XL, CoolRunner™, and Programming Solution products. Was this document helpful? Yes | No
|
1.0.2 |
75 KB |
07/28/2008 |
XCN07024 - Spartan-3A/-3AN/-3A DSP Chip-Select Controlled SelectMAP and ICAP Data Loading (PDF)
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The purpose of this Quality Alert is to communicate that the Non-continuous Slave Parallel (SelectMAP) or ICAP_SPARTAN3A data loading via de-asserting CSI_B does not function as expected, and is not a supported feature of these devices. Was this document helpful? Yes | No
|
1.0 |
44 KB |
11/26/2007 |
XCN08006 - Mold Compound Second Source for BGA Packages (PDF)
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Xilinx is adding a new second source molding compound for selected wirebond BGA packages.
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1.0.1 |
74 KB |
04/17/2008 |
XCN08016 - XQ2V6000-4CF1144M Assembly Material Set Changes (PDF)
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The purpose of this notice is to communicate changes in the assembly material set of the CF1144 package for the XQ2V6000-4CF1144M device. There is no change to the fit, form, function or reliability. Was this document helpful? Yes | No
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1.0 |
45 KB |
05/08/2008 |
XCN07020 - 增加针对 VO48/VOG48 封装的新运输托盘 (PDF)
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1.0.2 |
97 KB |
05/23/2008 |
XCN08015 - 更换某些开发板上的电源适配器 (PDF)
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1.0.1 |
208 KB |
05/23/2008 |
XCN07026 - 过渡到所选 Virtex-5 LXT 和 SXT 器件的第 1 步和新封装基片 (PDF)
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1.0.1 |
79 KB |
03/11/2008 |
XCN05018 - 芯片级(卷带)和无铅芯片级(卷带)的封装基板变更 (PDF)
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1.0.1 |
130 KB |
12/21/2007 |
PDN2002-09 - Discontinue M-Grade QPro XQ18V04 (PDF)
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|
2.0 |
45 KB |
10/20/2008 |
XCN08003 - Product Discontinuation Notice (PDF)
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The purpose of this notification is to communicate that Xilinx is discontinuing certain Development Systems Product Families. Was this document helpful? Yes | No
|
1.1 |
79 KB |
06/19/2008 |
XCN08020 - Adding Clear APET Vacuum Formed Tray Packing Media for BGA and QFP Packages (PDF)
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This notice is to communicate the addition of a Vacuum Formed Tray packing media for use with new pack multiple methodology for small quantity FCBGA, BGA, and QFP shipments. Was this document helpful? Yes | No
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1.0 |
93 KB |
08/11/2008 |
XCN08011 - Product Discontinuation Notice (PDF)
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The purpose of this notification is to communicate that Xilinx is discontinuing certain XC3000, XC4000XL, XC5206, Virtex®, Spartan®-3 products, and Aerospace & Defense "XQ" products. Was this document helpful? Yes | No
|
1.0 |
374 KB |
10/13/2008 |
XCN08014 - Package Substrate Change for Spartan-3A and Spartan-3AN Devices (PDF)
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This notice is to announce the standardization of remaining Spartan®-3A devices to the current 2-layer substrate for the FT256 and FTG256 packages.
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1.0 |
68 KB |
10/20/2008 |
XCN05019 - 用于军用产品的模塑料和附晶环氧树脂材料 (PDF)
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模塑料和附晶材料逐渐成为符合ROHS的产品所使用的同一材料。 符合ROHS的材料不含卤素,符合单位JEDEC标准J-STD-020C的湿度灵敏性级别(MSL)3,并且满足UL94 V-0可燃性要求。 组装材料的变化不影响器件的匹配度和功能。 Was this document helpful? Yes | No
|
1.0 |
157 KB |
10/24/2005 |
XCN06002 -停止使用某些军用及抗辐射器件 (PDF)
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1.0 |
52 KB |
01/30/2006 |
XCN06005 - CoolRunner™-II CPLD OTF SVF 编程问题 (PDF)
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1.0 |
38 KB |
01/30/2006 |
XCN06003 - Spartan™-IIE 与 Spartan-3 FTG256 无铅湿度敏感性等级变化 (PDF)
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1.0 |
57 KB |
01/30/2006 |
XCN06021 - XQVR300 和 XQVR600 QPro V 级 FPGA 测试设备中的变动 (PDF)
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1.0 |
35 KB |
10/23/2006 |
XCN06025 - 某些扩展温度器件停产 (PDF)
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1.0 |
41 KB |
01/01/2007 |
XCN07002 - 某些军用及抗辐射器件停产 (PDF)
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1.0 |
41 KB |
02/19/2007 |
XCN07003 - XC4000E、XC4000XL 和 XC4000XLA 系列中低容量 HQ 封装的产品停产 (PDF)
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Xilinx 将停止生产 XC4000E、XC4000XL 和 XC4000XLA 系列中低容量 HQ 封装的产品。 这些在售产品的所有速度级别和温度级别都会受到影响,包括 Xilinx 军用产品。 Was this document helpful? Yes | No
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1.0 |
34 KB |
02/19/2007 |
XCN08006 - Mold Compound Second Source for BGA Packages (PDF)
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Xilinx is adding a new second source molding compound for selected wirebond BGA packages.
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1.0.1 |
74 KB |
04/17/2008 |
XCN07010 - 产品停产更新 (PDF)
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1.0 |
50 KB |
05/14/2007 |
XCN07017 - Xilinx 倒装片产品的组装供应商和材料变更 (PDF)
View Document Details
本通知的目的是宣布新的第二源制造材料的技术指标,以及 Xilinx 塑料倒装片产品新增的第二源材料供应商。并且,还分步介绍了选定的 Virtex™-4 FX 产品的掩模组。
|
1.0 |
126 KB |
08/31/2007 |
XCN07020 - 增加针对 VO48/VOG48 封装的新运输托盘 (PDF)
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1.0.2 |
97 KB |
05/23/2008 |
XCN07022 - Product Discontinuation Notice (PDF)
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Xilinx is discontinuing certain Spartan®, XC4000XL, CoolRunner™, and Programming Solution products. Was this document helpful? Yes | No
|
1.0.2 |
75 KB |
07/28/2008 |
PDN99001 - XC3000 和 XC4000 SMD 某些速度级别与 M- 级的产品停产 (PDF)
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1.0 |
49 KB |
01/15/1999 |
PDN98006 - XC4003A M- 级和 B- 级 (SMD) 产品停产 (PDF)
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1.0 |
18 KB |
06/26/1998 |
PDN98005 - XC3100A M- 级和 B- 级 (SMD) 产品停产 (PDF)
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1.0 |
18 KB |
06/26/1998 |
PDN2003-01 - XC3020A、XC3042A 和 XC3090A 军用温度级 (PDF)
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1.0 |
20 KB |
01/17/2003 |
PDN2002-09 - Discontinue M-Grade QPro XQ18V04 (PDF)
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|
2.0 |
45 KB |
10/20/2008 |
PCN97007 - Xilinx MIL-STD-883 军用产品到 QML 的转化 (PDF)
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1.0 |
25 KB |
04/15/1997 |
PCN96010 - XC2000 产品系列停产 (PDF)
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1.0 |
18 KB |
12/20/1996 |
PCN96003 - 过时的商用和军用 CQFP-100 陶瓷封装产品 (PDF)
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1.0 |
19 KB |
05/03/1996 |
PCN95003 - 收回 XC1765DDD8R(过时器件) (PDF)
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|
1.0 |
16 KB |
04/17/1995 |
XCN05009 - 增加了用于Spartan-3系列的UMC 300mm晶元制造 (PDF)
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1.0.1 |
121 KB |
05/13/2005 |
XCN09003 - Additional Test Site for Spartan-3 FPGA Automotive XA Devices (PDF)
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The purpose of this notification is to add Xilinx Singapore “XAP” test site, as an additional test site for Spartan®-3 FPGA Automotive XA devices.
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1.0 |
48 KB |
01/19/2009 |
XCN08005 - Test Location and Topside Marking Change for Platform Flash and XC18V Flash Memory Devices (PDF)
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This notice is to communicate a change in the test equipment/location for all devices and the topside part marking for many devices in the Platform Flash (XCF) and XC18V families of flash memory configuration devices.
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1.0 |
77 KB |
02/16/2009 |
XCN09005 - Xilinx Product Discontinuation Notice for Development Systems Products (PDF)
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To communicate that Xilinx is discontinuing certain Development Systems Products. Was this document helpful? Yes | No
|
1.0 |
73 KB |
02/23/2009 |
XCN07025 - Package Substrate Change for Select Virtex-5 LX Devices (PDF)
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The purpose of this notification is to communicate a 10-layer package substrate change for select Virtex®-5 LX devices.
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1.0.1 |
44 KB |
03/11/2008 |
XCN09012 - Consolidation of On-package Capacitors in Virtex-5 FXT FPGA FF(G)1738 and FF(G)1136 Packages (PDF)
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The purpose of this document is to inform the customer of a standardization effort for on-package capacitors used in Virtex®-5 FXT FPGA FF(G)1738 and FF(G)1136 packages for the prefix “XC” Commercial “C” and Industrial “I” devices. Was this document helpful? Yes | No
|
1.0 |
68 KB |
03/23/2009 |
XCN09001 - Product Discontinuation Notice (PDF)
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To communicate that Xilinx is discontinuing certain XC1700, XC4000E, XC4000XLA, XC5200, Spartan®-IIE, Spartan-3AN, Virtex®, Virtex-E, Virtex-II, CPLD and Aerospace & Defense “XQ” products. Was this document helpful? Yes | No
|
1.0 |
74 KB |
04/27/2009 |
XCN09021 - Product Discontinuation Notice: Aerospace & Defense Customers (PDF)
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Xilinx will discontinue certain XQR2V6000 products with specific grades and package combinations due to supplier sustainability of an older product line with inconsistent run rate. Was this document helpful? Yes | No
|
1.0 |
34 KB |
08/17/2009 |
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