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Package Specifications

产品名称版本大小日期
PDFFF1156 - Package Drawing (1156 Ball Flip-Chip BGA) (PDF)
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 1.0 131 KB 06/04/2009
PDFBF957 - 封装示意图（标准塑料倒装片 BGA） (PDF)
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 1.0 67 KB 04/06/2001
PDFFF1759 - Package Drawing (1759 Ball Flip-Chip BGA) (PDF)
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 1.0 142 KB 06/08/2009
PDFFF1760 - Package Drawing (Standard Flip Chip BGA) (PDF)
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 1.1 149 KB 04/13/2006
PDFBF560 - 封装示意图（标准塑料倒装片 BGA） (PDF)
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 1.0 50 KB 10/30/2002
PDFSF363 - Package Drawing (Standard Flip-Chip BGA) (PDF)
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 1.2 98 KB 06/10/2008
PDFFF324 - 封装示意图（标准倒装片 BGA） (PDF)
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 1.0 63 KB 05/15/2006
PDFFF665 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
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 1.0 65 KB 09/24/2007
PDF FF1153 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
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 1.0 47 KB 10/11/2007
PDFFF1148 - 封装示意图（标准塑料倒装片 BGA） (PDF)
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 1.0 82 KB 10/30/2002
PDFHQG208 - 材料成份声明数据手册（无铅散热型 PQFP） (PDF)
Was this document helpful? Yes | No
 1.2 83 KB 09/28/2006
PDFFG456 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2 84 KB 09/21/2006
PDF QFG48 - 材料成份声明数据手册（无铅方形扁平封装） (PDF)
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 1.0 77 KB 10/05/2006
PDFCS280 - 材料成份声明数据手册（标准 Flex Tape 芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 78 KB 10/05/2006
PDFCPG132 - 材料成份声明数据手册（无铅芯片级 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.3 85 KB 09/28/2006
PDFFFG1148 - 材料成分声明数据手册（无铅塑料倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.2 88 KB 09/27/2006
PDFFFG896 - 材料成份声明数据手册（无铅塑料倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.2 91 KB 09/27/2006
PDFFFG672 - 材料成份声明数据手册（无铅塑料倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.2 88 KB 09/27/2006
PDFPG84 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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 1.1 39 KB 04/06/2001
PDF FFG676 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 85 KB 10/05/2006
PDFFT64/FTG64 - 封装示意图（精确栅距 (Fine Pitch) 薄型 BGA） (PDF)
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 1.0 66 KB 05/14/2008
PDFCG1156 - Package Drawing (Ceramic BGA) (PDF)
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 1.0 79 KB 06/01/2000
PDFCF1144 - Package Drawing (Ceramic Flip-Chip with Column Attach) (PDF)
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 1.1 169 KB 04/13/2006
PDFCG560 - Package Drawing (Ceramic Column Grid Array) (PDF)
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 1.0.1 109 KB 10/28/2002
PDFCG717 - Package Drawing (Ceramic Column Grid Array) (PDF)
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 1.0 101 KB 01/18/2006
PDFEF1136 - Package Drawing (1136 Ball Flip-Chip BGA) (PDF)
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 1.0 128 KB 05/26/2009
PDFEF676 - Package Drawing (676 Ball Flip-Chip BGA) (PDF)
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 1.0 129 KB 05/26/2009
PDFTQ144/TQG144 - Package Drawing (TQFP) (PDF)
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 1.2 147 KB 06/18/2004
PDFFFG1760 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.0 86 KB 10/05/2006
PDFFF1760 - Material Declaration Data Sheet (Standard Flip Chip BGA) (PDF)
Design Files: IPC-1752 Form
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 1.0 84 KB 10/05/2006
PDFFG676 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
Design Files: IPC-1752 Form
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 1.2 84 KB 09/25/2006
PDFTQG144 - Material Declaration Data Sheet (Pb-free TQFP) (PDF)
Design Files: IPC-1752 Form
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 1.2.1 80 KB 10/19/2006
PDFFT256/FTG256 - 封装示意图（精确栅距 (Fine Pitch) 薄型 BGA） (PDF)
Was this document helpful? Yes | No
 1.2.1 85 KB 03/23/2005
PDFFG676/FGG676 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2.1 110 KB 04/12/2005
PDFFG484/FGG484 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
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 1.0 84 KB 03/01/2005
PDFFF784 - Package Drawing (784 Ball Flip-Chip BGA) (PDF)
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 1.0 184 KB 06/24/2009
PDFFG484 - Material Declaration Data Sheet (Standard Fine-Pitch BGA) (PDF)
Design Files: IPC-1752 Form
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 1.0.2 25 KB 12/12/2008
PDFFT256 - Material Declaration Data Sheet (Standard Fine-Pitch Thin BGA) (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.2 83 KB 09/21/2006
PDFEF665 - Package Drawing (665 Ball Flip-Chip BGA) (PDF)
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 1.0 130 KB 05/26/2009
PDFEF1738 - Package Drawing (1738 Ball Flip-Chip BGA) (PDF)
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 1.0 134 KB 05/26/2009
PDFEF1153 - Package Drawing (1153 Ball Flip-Chip BGA) (PDF)
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 1.0 129 KB 05/26/2009
PDFCSG324 - Package Drawing (324 Ball Chip-Scale BGA) (PDF)
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 1.0 123 KB 06/24/2009
PDFCC44 - 陶瓷芯片载体封装 (PDF)
Was this document helpful? Yes | No
 1.0 78 KB 10/28/2002
PDFFGG320 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.2 86 KB 09/27/2006
PDFPC44 - 材料成份声明数据手册（标准 PLCC） (PDF)
Was this document helpful? Yes | No
 1.2 78 KB 09/29/2006
PDFSO20 - 封装示意图（标准 SOIC） (PDF)
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 1.0 90 KB 06/01/2000
PDFHQ304 - 材料成份声明数据手册（标准散热型 QFP） (PDF)
Was this document helpful? Yes | No
 1.0 81 KB 10/18/2006
PDFCSG484 - Material Declaration Data Sheet (Laminate Chip Scale BGA) (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 56 KB 11/27/2007
PDFCS484/CSG484 - Package Drawing (Laminate Chip Scale BGA) (PDF)
Was this document helpful? Yes | No
 1.0 97 KB 04/02/2007
PDFPQG44 - 材料成份声明数据手册（无铅 PQFP） (PDF)
Was this document helpful? Yes | No
 1.0 75 KB 10/05/2006
PDFFF1696 - 封装示意图（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 85 KB 10/30/2002
PDFFGG900 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA) (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.3 62 KB 09/13/2007
PDFFG900/FGG900 - Package Drawing (Fine-Pitch BGA) (PDF)

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Was this document helpful? Yes | No
 1.3 71 KB 03/12/2009
PDFFG256/FGG256 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.2.1 97 KB 04/12/2005
PDFBGG256 - 材料成份声明数据手册（无铅塑料 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 37 KB 01/15/2007
PDFFFG323 - 材料成份声明数据手册（标准 BGA 倒装片） (PDF)
Was this document helpful? Yes | No
 1.0 70 KB 12/12/2007
PDFBGG432 - 材料成份声明数据手册（无铅金属 BGA - Cavity Down） (PDF)
Was this document helpful? Yes | No
 1.0.1 87 KB 01/08/2007
PDFCPG56 - 材料成份声明数据手册（无铅芯片级 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.2 85 KB 09/28/2006
PDFSFG363 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.2 96 KB 09/28/2006
PDFPQ160 - 材料成份声明数据手册（标准 PQFP） (PDF)
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 1.2.1 81 KB 10/19/2006
PDFPQ100 - 材料成份声明数据手册（标准 PQFP） (PDF)
Was this document helpful? Yes | No
 1.3.1 82 KB 10/19/2006
PDFHQ240 - 材料成份声明数据手册（标准散热型 PQFP） (PDF)
Was this document helpful? Yes | No
 1.2 82 KB 10/03/2006
PDFVQ64/VQG64 - Package Drawing (VQFP) (PDF)
Was this document helpful? Yes | No
 1.2 121 KB 06/18/2004
PDFCS280/CSG280 - 封装示意图（层压芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 62 KB 12/05/2005
PDFFFG1517 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.3 88 KB 09/22/2006
PDFFG860 - 封装示意图（标准精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.1 62 KB 04/06/2001
PDFFGG680 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.2 90 KB 09/22/2006
PDFFGG676 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.2 85 KB 09/27/2006
PDFPQG208 - 材料成份声明数据手册（无铅 PQFP） (PDF)
Was this document helpful? Yes | No
 1.2.1 80 KB 10/19/2006
PDFFF1152 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 85 KB 09/28/2006
PDFFF1148 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 85 KB 09/27/2006
PDFFF896 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 87 KB 09/28/2006
PDFFF668 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.3 87 KB 09/27/2006
PDFCS48 - 材料成份声明数据手册（标准芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 83 KB 09/28/2006
PDFFF676 - 封装示意图（标准倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.1 123 KB 08/27/2007
PDFPD8 - 材料成份声明数据手册（标准塑料 DIP） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 09/29/2006
PDFPC84 - 材料成份声明数据手册（标准 PLCC） (PDF)
Was this document helpful? Yes | No
 1.2 87 KB 10/05/2006
PDFVQ44/VQG44 - 封装示意图 (VQFP) (PDF)
Was this document helpful? Yes | No
 1.2 121 KB 06/18/2004
PDF PG223 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
Was this document helpful? Yes | No
 1.0 104 KB 06/01/2000
PDFPG191 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
Was this document helpful? Yes | No
 1.1 47 KB 04/06/2001
PDF SO8 - 材料成份声明数据手册（标准 SOIC） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 46 KB 08/15/2007
PDFVOG20 - 材料成份声明数据手册（无铅 TSSOP） (PDF)
Was this document helpful? Yes | No
 1.2 82 KB 09/29/2006
PDFPDG8 - 材料成份声明数据手册（无铅塑料 DIP） (PDF)
Was this document helpful? Yes | No
 1.2 80 KB 09/28/2006
PDFTQG100 - 材料成份声明数据手册（无铅 TQFP） (PDF)
Was this document helpful? Yes | No
 1.2.1 80 KB 10/19/2006
PDFCP56 - 材料成份声明数据手册（标准芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 09/28/2006
PDFFF1704 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.1 85 KB 09/21/2006
PDFFF1696 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.1 87 KB 09/21/2006
PDFFF1517 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.3 39 KB 05/21/2008
PDFFF1513 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.3 85 KB 09/28/2006
PDFCSG280 - 材料成份声明数据手册（无铅 Flex Tape 芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 75 KB 10/05/2006
PDFBG225 - 材料成份声明数据手册（标准塑料 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.2.1 72 KB 01/08/2007
PDFSF363 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 85 KB 09/28/2006
PDFHQG240 - 材料成份声明数据手册（无铅散热型 PQFP） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 09/28/2006
PDFCS280/CSG280 - 封装示意图（Flex Tape 芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.2.2 58 KB 11/29/2005
PDFCS144/CSG144 - 封装示意图（层压芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.1 69 KB 05/31/2006
PDFCS144/CSG144 - 封装示意图（Flex Tape 芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.3 49 KB 01/15/2007
PDFCB164 - 封装示意图（陶瓷铜焊 QFP） (PDF)
Was this document helpful? Yes | No
 1.0.1 89 KB 04/17/2008
PDFFF324 - Material Declaration Data Sheet (Standard Flip-Chip BGA) (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 38 KB 03/25/2008
PDFCB228 - Package Drawing (Ceramic Brazed QFP) (PDF)
Was this document helpful? Yes | No
 1.0.1 145 KB 05/05/2008
PDFFTG64 - Material Declaration Data Sheet (Pb-free Fine-Pitch Thin BGA) (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 29 KB 05/06/2008
PDFFT64 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) 薄型 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 39 KB 05/06/2008
PDFFF1704 - 封装示意图（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 85 KB 10/30/2002
PDFCSG48 - 材料成份声明数据手册（无铅芯片级 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.3 86 KB 09/28/2006
PDFBGG575 - Material Declaration Data Sheet (Molded BGA) (PDF)
Was this document helpful? Yes | No
 1.0 26 KB 05/26/2009
PDFCSG324 - Material Declaration Data Sheet (Chip-Scale BGA) (PDF)

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Was this document helpful? Yes | No
 1.0 52 KB 07/09/2009
PDFFGG400 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA) (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.3.2 26 KB 12/12/2008
PDFFF676 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 84 KB 10/05/2006
PDFFF323/FFG323 - Package Drawing (Standard BGA Flip-Chip) (PDF)
Was this document helpful? Yes | No
 1.1 75 KB 03/24/2008
PDFFF323 - 材料成份声明数据手册（标准 BGA 倒装片） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 63 KB 12/12/2007
PDFFF484 - Package Drawing (484 Ball Flip-Chip BGA) (PDF)
Was this document helpful? Yes | No
 1.0 149 KB 06/24/2009
PDFCSG225 - Package Drawing (225 Ball Chip-Scale BGA) (PDF)
Was this document helpful? Yes | No
 1.0 123 KB 06/24/2009
PDFFF665 - 封装示意图（标准倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 114 KB 03/22/2007
PDF FG900 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.0 82 KB 09/21/2006
PDFPQ208/PQG208 - 封装示意图 (PQFP) (PDF)
Was this document helpful? Yes | No
 1.2 155 KB 06/18/2004
PDFPQ160/PQG160 - 封装示意图 (PQFP) (PDF)
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 1.2 154 KB 06/18/2004
PDFPQ100 - 封装示意图（标准 PQFP） (PDF)
Was this document helpful? Yes | No
 1.2 73 KB 10/17/2002
PDFPP175 - 封装示意图（标准塑料 PGA） (PDF)
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 1.1 54 KB 04/06/2001
PDFFFG1696 - 材料成份声明数据手册（无铅塑料倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.2 90 KB 09/22/2006
PDFPCG44 - 材料成份声明数据手册（无铅 PLCC） (PDF)
Was this document helpful? Yes | No
 1.2 77 KB 09/28/2006
PDFFFG1738 - 材料成份声明数据手册（无铅倒装片精确栅距 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 33 KB 01/15/2007
PDFFF1738 - 材料成份声明数据手册（标准倒装片精确栅距 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 90 KB 01/17/2007
PDFBGG352 - 材料成份声明数据手册（无铅金属 BGA - Cavity Down） (PDF)
Was this document helpful? Yes | No
 1.0.1 83 KB 01/08/2007
PDFFFG1153 - 材料成份声明数据手册（无铅倒装片精确栅距 BGA） (PDF)
Was this document helpful? Yes | No
 1.0 82 KB 01/08/2007
PDFFFG324 - 材料成份声明数据手册（标准倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.0 38 KB 03/25/2008
PDFFF672 - 封装示意图（标准塑料倒装片 BGA） (PDF)
Was this document helpful? Yes | No
 1.1 78 KB 10/11/2005
PDFFG860 - 材料成份声明数据手册（标准精确栅距 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 88 KB 09/25/2006
PDFPC20/PCG20 - 封装示意图 (PLCC) (PDF)
Was this document helpful? Yes | No
 1.2 91 KB 06/18/2004
PDFFG400/FGG400 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.0 76 KB 03/01/2005
PDFFFG1704 - 材料成份声明数据手册（无铅塑料倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
Was this document helpful? Yes | No
 1.1 86 KB 09/21/2006
PDFFG320 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.2 84 KB 09/21/2006
PDFFG256 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
Was this document helpful? Yes | No
 1.2 84 KB 09/14/2006
PDFFS48 - 材料成份声明数据手册（标准芯片级 BGA） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 09/29/2006
PDFVQ44 - 材料成份声明数据手册（标准 VQFP） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 10/05/2006
PDFTQ176 - 材料成份声明数据手册（标准 TQFP） (PDF)
Was this document helpful? Yes | No
 1.2 78 KB 10/05/2006
PDFTQ144 - 材料成份声明数据手册（标准 TQFP） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 10/03/2006
PDFTQ100 - 材料成份声明数据手册（标准 TQFP） (PDF)
Was this document helpful? Yes | No
 1.2 81 KB 09/29/2006
PDFCP56/CPG56 - 封装示意图（芯片级 BGA） (PDF)
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PDFCP132/CPG132 - 封装示意图（芯片级 BGA） (PDF)
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 1.2 82 KB 06/22/2004
PDFCC44 - 封装示意图（标准陶瓷芯片载体） (PDF)
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 1.0 78 KB 10/28/2002
PDFBG432 - 材料成份声明数据手册（标准金属 BGA - Cavity Down） (PDF)
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PDFVQG100 - 材料成份声明数据手册（无铅 VQFP） (PDF)
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PDFVQG64 - 材料成份声明数据手册（无铅 VQFP） (PDF)
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 1.3 80 KB 09/28/2006
PDFFF896 - 封装示意图（标准塑料倒装片 BGA） (PDF)
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 1.0 72 KB 04/06/2001
PDF FF672 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
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 1.4 68 KB 01/27/2007
PDFPG120 - 封装示意图（标准陶瓷 (Ceramic) BGA） (PDF)
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PDFPD08 - 封装示意图（标准塑料 (Plastic) DIP） (PDF)
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PDFSOG20 - 材料成份声明数据手册（无铅 SOIC） (PDF)
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PDFSO20 - 材料成份声明数据手册（标准 SOIC） (PDF)
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 1.0 84 KB 10/05/2006
PDFVO8 - 封装示意图（标准 TSOP） (PDF)
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PDFFFG668 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
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 1.2 89 KB 09/22/2006
PDFFS48 - 封装示意图（标准芯片级 BGA） (PDF)
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 1.0.1 74 KB 04/12/2005
PDFVO20/VOG20 - 封装示意图 (TSSOP) (PDF)
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 1.2.1 85 KB 04/12/2005
PDFHQ208 - 材料成份声明数据手册（标准散热型 PQFP） (PDF)
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 1.2 85 KB 10/03/2006
PDFPQ44 - 材料成份声明数据手册（标准 PQFP） (PDF)
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 1.0 82 KB 10/05/2006
PDFPCG20 - 材料成份声明数据手册（无铅 PLCC） (PDF)
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PDFPC20 - 材料成份声明数据手册（标准 PLCC） (PDF)
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 1.0 79 KB 10/05/2006
PDFPG175 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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PDFPG156 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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 1.1 47 KB 04/06/2001
PDFBG225 - 封装示意图（标准塑料 BGA） (PDF)
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 1.1 32 KB 04/06/2001
PDF HQ160/HQG160 - 封装示意图（散热型 PQFP） (PDF)
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 1.2 155 KB 06/18/2004
PDFBG560 - 材料成份声明数据手册（标准金属 BGA） (PDF)
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PDFBG256 - 材料成份声明数据手册（标准塑料 BGA） (PDF)
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 1.2.1 79 KB 01/08/2007
PDFFF1517 - 封装示意图（标准倒装片 BGA） (PDF)
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 1.0 85 KB 04/06/2001
PDFFF1513 - 封装示意图（标准倒装片 BGA） (PDF)
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 1.0 132 KB 09/13/2004
PDFFF1153 - 封装示意图（标准倒装片 BGA） (PDF)
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 1.0 109 KB 05/15/2006
PDFFF1152 - 封装示意图（标准倒装片 BGA 封装） (PDF)
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 1.0 76 KB 04/06/2001
PDFPG132 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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 1.1 47 KB 04/06/2001
PDFBG728/BGG728 - 封装示意图（塑料 BGA） (PDF)
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 1.1 85 KB 04/13/2006
PDFBG575/BGG575 - 封装示意图 (Molded BGA) (PDF)
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 1.2.1 118 KB 03/24/2005
PDFBG560 - 封装示意图（标准金属 BGA） (PDF)
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 1.1 54 KB 04/06/2001
PDFBG492 - 封装示意图（标准塑料 BGA） (PDF)
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PDFBG432 - 封装示意图（标准金属 BGA - Cavity Down） (PDF)
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 1.1 54 KB 04/06/2001
PDFBG388 - 封装示意图（标准塑料 BGA） (PDF)
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 1.1 56 KB 09/26/2002
PDFBG352 - 封装示意图（标准金属 BGA - Cavity Down） (PDF)
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PDFBG256/BGG256 - 封装示意图（塑料 BGA） (PDF)
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 1.3 98 KB 03/19/2007
PDFPG559 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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 1.1 130 KB 04/06/2001
PDFPC84/PCG84 - 封装示意图 (PLCC) (PDF)
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 1.2 91 KB 06/18/2004
PDFPC68/PCG68 - 封装示意图 (PLCC) (PDF)
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 1.2 91 KB 06/18/2004
PDFPC44/PCG44 - 封装示意图 (PLCC) (PDF)
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 1.2 90 KB 06/18/2004
PDFFG324/FGG324 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2.1 99 KB 03/23/2005
PDFFG320/FGG320 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2.1 97 KB 03/23/2005
PDFVO48/VOG48 - 封装示意图 (TSOP) (PDF)
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 1.2.1 116 KB 03/23/2005
PDFTQ176/TQG176 - 封装示意图 (TQFP) (PDF)
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 1.2 148 KB 06/18/2004
PDFFG680 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2 88 KB 09/25/2006
PDFCP132 - 材料成份声明数据手册（标准芯片级 BGA） (PDF)
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 1.1 82 KB 09/28/2006
PDFVQ64 - 材料成份声明数据手册（标准 VQFP） (PDF)
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 1.3 82 KB 10/03/2006
PDFPQ240 - 材料成份声明数据手册（标准 PQFP） (PDF)
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 1.2.1 84 KB 10/19/2006
PDFFG324 - 材料成份声明数据手册（标准精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2 90 KB 09/21/2006
PDFPQG160 - 材料成份声明数据手册（无铅 PQFP） (PDF)
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 1.2.1 81 KB 10/19/2006
PDFFG400 - Material Declaration Data Sheet (Standard Fine Pitch BGA) (PDF)
Design Files: IPC-1752 Form
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 1.0.2 26 KB 12/12/2008
PDFVOG8 - 材料成份声明数据手册（无铅 TSOP） (PDF)
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 1.3 67 KB 02/20/2007
PDFVO48 - 材料成份声明数据手册（标准 TSOP） (PDF)
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 1.0 73 KB 09/29/2006
PDFFF668 - 封装示意图（标准倒装片 BGA） (PDF)
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 1.0 104 KB 09/13/2004
PDFPP132 - 封装示意图（标准塑料 PGA） (PDF)
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 1.1 54 KB 04/06/2001
PDF SOG8 - 材料成份声明数据手册（无铅 SOIC） (PDF)
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 1.0 64 KB 08/15/2007
PDFHT144/HTG144 - 封装示意图（散热型 TQFP） (PDF)
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 1.2 148 KB 06/18/2004
PDF BFG957 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
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 1.0 88 KB 09/21/2006
PDFBF957 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.0 94 KB 09/21/2006
PDFFF1738 - 封装示意图（标准倒装片精确栅距 BGA） (PDF)
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 1.0 162 KB 07/13/2007
PDFFTG256 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) 薄型 BGA） (PDF)
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 1.2 92 KB 09/21/2006
PDFCS144 - 材料成份声明数据手册（标准层压芯片级 BGA） (PDF)
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 1.2 81 KB 09/28/2006
PDFCB196 - 封装示意图（陶瓷铜焊 QFP） (PDF)
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 1.0.1 84 KB 04/17/2008
PDFCB100 - 封装示意图（陶瓷铜焊 QFP） (PDF)
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PDFDD8 - 封装示意图（标准陶瓷 (Ceramic) DIP） (PDF)
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 1.0 27 KB 04/06/2001
PDFFGG860 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2 90 KB 09/22/2006
PDFVO8 - 材料成份声明数据手册（标准 TSOP） (PDF)
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 1.1 67 KB 02/20/2007
PDFVQ100 - 材料成份声明数据手册（标准 VQFP） (PDF)
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 1.2 81 KB 10/05/2006
PDFPQ208 - 材料成份声明数据手册（标准 PQFP） (PDF)
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 1.2.1 109 KB 10/19/2006
PDFVO20 - 材料成份声明数据手册（标准 TSOP） (PDF)
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 1.0 82 KB 10/05/2006
PDFFG680/FGG680 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2.1 126 KB 04/12/2005
PDFSO8 - 封装示意图（标准 SOIC） (PDF)
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PDFQFG48 - 封装示意图（无铅方形扁平封装） (PDF)
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PDFQFG32 - 封装示意图（无铅方形扁平封装） (PDF)
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 1.0 89 KB 08/13/2004
PDFPQG240 - 材料成份声明数据手册（无铅 PQFP） (PDF)
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 1.2.1 83 KB 10/19/2006
PDFFG456/FGG456 - 精确栅距 (Fine Pitch) BGA (PDF)
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 1.2.1 110 KB 03/23/2005
PDFTQ100/TQG100 - 封装示意图 (TQFP) (PDF)
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 1.2 147 KB 06/18/2004
PDFPQ44/PQG44 - 封装示意图 (PQFP) (PDF)
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 1.2 154 KB 06/18/2004
PDFPQ240/PQG240 - 封装示意图 (PQFP) (PDF)
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 1.2 154 KB 06/18/2004
PDFPG475 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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PDFPG411 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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PDFPG299 - 封装示意图（标准陶瓷 (Ceramic) PGA） (PDF)
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 1.0 116 KB 06/01/2000
PDFCS484 - 材料成份声明数据手册（层压芯片级 BGA） (PDF)
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 1.0 60 KB 11/27/2007
PDFVQG44 - 材料成份声明数据手册（无铅 VQFP） (PDF)
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 1.2 80 KB 09/28/2006
PDFTQG176 - 材料成份声明数据手册（无铅 TQFP） (PDF)
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 1.2 76 KB 09/28/2006
PDFFGG484 - Material Declaration Data Sheet (Pb-free Fine-Pitch BGA) (PDF)
Design Files: IPC-1752 Form
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 1.3.1 26 KB 12/12/2008
PDFFGG324 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
Design Files: IPC-1752 Form
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 1.2 85 KB 09/21/2006
PDFHT100/HTG100 - 封装示意图（散热型 TQFP） (PDF)
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 1.2 148 KB 06/18/2004
PDFHQ304 - 封装示意图（标准散热型 QFP） (PDF)
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 1.1 66 KB 10/17/2002
PDFHQ240/HQG240 - 封装示意图（散热型 PQFP） (PDF)
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PDFHQ208/HQG208 - 封装示意图（散热型 PQFP） (PDF)
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 1.2 155 KB 06/18/2004
PDFBG352 - 材料成份声明数据手册（标准金属 BGA - Cavity Down） (PDF)
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 1.0.1 81 KB 01/08/2007
PDFFG1156/FGG1156 - 封装示意图（精确栅距 (Fine Pitch) BGA） (PDF)
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 1.2.1 138 KB 03/23/2005
PDFVQ100/VQG100 - 封装示意图 (VQFP) (PDF)
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 1.2.1 99 KB 02/26/2007
PDFFF1136 - 封装示意图（标准塑料倒装片 BGA） (PDF)
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 1.0 147 KB 03/22/2007
PDFCS48/CSG48 - 封装示意图（芯片级 BGA） (PDF)
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 1.2.1 74 KB 04/12/2005
PDF FFG1136 - 材料成份声明数据手册（无铅塑料倒装片 BGA） (PDF)
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 1.0 67 KB 08/06/2007
PDF FF1136 - 材料成份声明数据手册（标准塑料倒装片 BGA） (PDF)
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 1.0 66 KB 08/06/2007
PDF FFG665 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
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 1.0 83 KB 04/09/2007
PDFPQG100 - 材料成份声明数据手册（无铅 PQFP） (PDF)
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 1.3.1 81 KB 10/19/2006
PDFHT176/HTG176 - 封装示意图（散热型 TQFP） (PDF)
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 1.2 148 KB 06/18/2004
PDFVOG48 - 材料成份声明数据手册（无铅 TSOP） (PDF)
Design Files: IPC-1752 Form
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 1.2 72 KB 09/29/2006
PDFFFG1513 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.3 95 KB 09/22/2006
PDFFFG1152 - 材料成份声明数据手册（无铅倒装片 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.2 87 KB 09/27/2006
PDFFGG456 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
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 1.3 87 KB 09/27/2006
PDFCSG144 - 材料成份声明数据手册（无铅层压芯片级 BGA） (PDF)
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 1.2 85 KB 09/28/2006
PDFFGG256 - 材料成份声明数据手册（无铅精确栅距 (Fine Pitch) BGA） (PDF)
Design Files: IPC-1752 Form
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 1.1 91 KB 06/29/2006
PDFFSG48 - 材料成份声明数据手册（无铅芯片级 BGA） (PDF)
Design Files: IPC-1752 Form
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 1.3 68 KB 08/01/2007
PDFFF1155 - Package Drawing (1156 Ball Flip-Chip BGA) (PDF)
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 1.0 150 KB 09/23/2009
PDFFF1760 - Package Drawing (Standard Flip Chip BGA) (PDF)
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 1.1 149 KB 04/13/2006
PDFFGG676 - Material Declaration Data Sheet (Used by XC3S(D)1400AN) (PDF)
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 1.0 54 KB 09/21/2009
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