UPGRADE YOUR BROWSER

We have detected your current browser version is not the latest one. Xilinx.com uses the latest web technologies to bring you the best online experience possible. Please upgrade to a Xilinx.com supported browser:Chrome, Firefox, Internet Explorer 11, Safari. Thank you!

AR# 12916

Device RMA - How do I properly remove a device from a PCB (rework) in order to return it to Xilinx as an RMA?

描述

Keywords: customer, board, bad, device, failing, part, damage, guidelines, FPGA, CPLD, reball

Urgency: Standard

General Description:
How do I properly remove a device from a PCB (board) in order to return it to Xilinx as an RMA?

NOTE: If you have a device that requires an RMA, please contact your FAE or open a WebCase at:
http://support.xilinx.com/support/clearexpress/websupport.htm

解决方案

To remove a Xilinx device from a board, after receiving the RMA approval through the RMA process, please adhere to the guidelines below. It is essential that these guidelines be followed to avoid damage to the returned device.

1. For SMT packages (QFP, PLCC, or BGA), refer to the "SMT Package Rework" white paper at:
http://www.xilinx.com/literature/index.htm
To access the white paper:
a. Select "White Papers" under Products and Services.
b. Scroll or perform a search to locate the "SMT Package Rework" white paper.
c. Click to open the PDF document.
2. For flip-chip packages, refer to (Xilinx XAPP426): "Implementing Xilinx Flip-Chip BGA Packages."
AR# 12916
日期 03/03/2005
状态 Active
Type ??????
的页面