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AR# 156

PACKAGING: PLCC Chips fail on multichip board--swapped in chips function ok.

描述

Plastic package chips are sensitive to moisture. Chips may be ordered as
"baked", or users should bake the devices themselves to remove any residual
moisture. If this is not done, some board assembly instertion methods may
damage the chip.

解决方案

AR# 156
日期 11/05/1996
状态 Archive
Type ??????
的页面