AR# 40688


Packaging Design Assistant


The Packaging Design Assistant outlines packaging related information based different steps in the process, whether trying to select a part or package, compiling design considerations for a board layout, or looking for more info during assembly.

NOTE: This answer record is part of the Xilinx Packaging Solution Center (Xilinx Answer 40687). The Xilinx Packaging Solution Center is available to address all questions related Packaging.


First, select the design phase where you have a question or are troubleshooting an issue related to your configuration solution. This ensures that the Packaging Design Assistant points you to the information you need to continually move forward with your design.

(Xilinx Answer 40691) Part Selection and Ordering: The part markings are further explained here along with material declaration, explanations of stepping, and device specific packaging common questions are all addressed here.
(Xilinx Answer 40690) Layout and Design Considerations: Issues such as temperature design issues, heat sink selection, and flight time for packages are all explained here.
(Xilinx Answer 40689) Assembly Process: The device reliability information, and moisture and information can all be found here.



Answer Number 问答标题 问题版本 已解决问题的版本
40687 Packaging Solution Center N/A N/A
AR# 40688
日期 09/24/2012
状态 Archive
Type 解决方案中心
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