The Packaging Design Assistant outlines packaging related information based different steps in the process, whether trying to select a part or package, compiling design considerations for a board layout, or looking for more info during assembly.
NOTE: This answer record is part of the Xilinx Packaging Solution Center (Xilinx Answer 40687). The Xilinx Packaging Solution Center is available to address all questions related Packaging.
Answer Number | 问答标题 | 问题版本 | 已解决问题的版本 |
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40687 | Packaging Solution Center | N/A | N/A |
AR# 40688 | |
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日期 | 09/24/2012 |
状态 | Active |
Type | 解决方案中心 |