描述

General Description:

What is the alloy composition of the solder balls in the BG, FG, and CS packages? Does the FF package have the same alloy composition?

解决方案

The BG, FG, FT, CS, CP, and FF packages all have standard eutectic solder balls (i.e., they are 63% Sn, 37% Pb).

For solder ball size, refer to the package drawings available at:

http://www.xilinx.com/

Go to Documentation --> Package Drawings (under the Hardware section of Technical Documentation).

Package key:

BG: Ball Grid Array (BGA) package

FG, FT: Fine pitch BGA package

CS, CP: Chip-scale package

FF: Flip-Chip BGA package

The solder column composition for Ceramic Column Grid Array packages designed for Hi-rel devices (CG & CF packages) is 95 Pb / 5 Sn.