What is the alloy composition of the solder balls in the BG, FG, and CS packages? Does the FF package have the same alloy composition?
The BG, FG, FT, CS, CP, and FF packages all have standard eutectic solder balls (i.e., they are 63% Sn, 37% Pb).
For solder ball size, refer to the package drawings available at:
Go to Documentation --> Package Drawings (under the Hardware section of Technical Documentation).
BG: Ball Grid Array (BGA) package
FG, FT: Fine pitch BGA package
CS, CP: Chip-scale package
FF: Flip-Chip BGA package
The solder column composition for Ceramic Column Grid Array packages designed for Hi-rel devices (CG & CF packages) is 95 Pb / 5 Sn.