AR# 53177
14.3 - XPS I/O Module - XPS I/O Module is not addressable when exported to SDK
描述
In XPS projects using the LMB I/O Module IP from the IP Catalog, the I/O Module is not addressable as shown below:
unaddressed_ip.jpg
When exported to SDK this is preventing the I/O Module being addressable, thus not showing up.
How can I fix this?
解决方案
This issue is only seen in the XPS version of the I/O Module, the I/O Module used with the MicroBlaze MCS (Micro Control System) does not show this addressing issue.
Follow the steps below to workaround this issue in XPS:
Step 1: Make the IP local.
In System Assembly view, under the Bus Interfaces tab, right-click on the I/O Module IP:
make_io_module_local.jpg
Step 2:Open theMPD file.
In System Assembly View, under the Bus Interfaces tab, right-click and select View MPD:
view_mpd_file_iomodule.jpg
Step 3: Modify the MPD file.
Modify lines 85 and 86, as highlighted below and save:
mod_mpd_iomodule.jpg
Step 4: Rescan the User Repositories.
To rescan the User Repositories, go to Project -> Rescan User Repositories:
rescan_user_repos_14_3.jpg
Step 4: Verify the I/O Module is mapped correctly.
In System Assembly View, under theAddresses tab right-click andverify that the addresses are all mapped:
updated_addresses_iomodule.jpg
Now, re-export to SDK and the I/O Module should show up in the SDK.
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| AR# 53177 | |
|---|---|
| 日期 | 11/30/2012 |
| 状态 | Active |
| Type | 综合文章 |
| Tools |
|