AR# 50991

Zynq-7000 SoC - What devices are supported for configuration?

描述

When choosing a flash device to incorporate with Zynq-7000 devices, it is important to consider the following logistical criteria:

  • Is the device supported with the Xilinx tools?
  • Will the device work with the Zynq device BootROM?
  • Is the device supported with software like U-Boot and Linux?

此外还提供了一些设计考虑因素,包括:

  • How many pins are required for a configuration method?
  • How much flash memory is required?
  • How fast can the Zynq-7000 device be configured?
  • How difficult is it to manage the flash device?

Based on the logistical criteria, there are three categories of flash devices:

  • - These devices meet the logistical criteria listed above.





  • - These devices have not been tested in any way by Xilinx with Zynq-7000 devices.





Xilinx 只能为列表中标示为“Xilinx 已测试和支持”的器件提供技术支持。

解决方案

QSPI

Benefits of QSPI:

  • High performance - QSPI is the fastest configuration solution.
  • Low Pin count - QSPI has the lowest pin count of the configuration solution options besides SD.
  • Easy management - QSPI can be accessed as linear memory in Zynq-7000 devices.此外,不需要坏模块管理。

Downsides of QSPI:

  • Low memory density - QPSI is only supported up to 16 MB in single linear mode or 32 MB in dual linear mode because linear QSPI controllers only support 3-byte addressing.

供应商

供应商 QSPI Flash FamiliesNotes
N25Q,MT25
25FL
  • S25FL129P is Not Recommended for New Designs.Recommend using the S25FL127S or S25FL128S for all new designs.
  • The Spansion S25FS family does not support Dual Out (0x3B) and Quad Out (0x6B) read commands
  • The non-volatile bit (Quad Enable bit) of the Spansion flash must be set.
MX25,MX66
  • 2015.3 FSBL and earlier requires modifications.
W25Q
  • For Automotive & Industrial Plus Grades: Meet hold timing (tHOmin=0ns) only with Feedback Clock Disabled (QSPICLK < 40MHz).
IS25LP


Configuration and Specifications

MIO PinsMax Memory Size in Linear Mode
716 MB
832 MB
1332 MB


Xilinx Supported Devices


Flash DeviceMode供应商Flash Density支持
类别
Xilinx Tool**U-Boot*Notes
Quad Mode - Single, Dual Stacked and Dual ParallelMicron64Mb3.3V
Vivado**2013.10
N25Q128AQuad Mode - Single, Dual Stacked and Dual ParallelMicron128 Mb1.8V/3.3V
Vivado** / ISE 14.12013.04
Quad Mode - Single, Dual Stacked and Dual ParallelMicron256Mb3.3V
Vivado** / ISE 14.7(patch)2013.04
Quad Mode - Single, Dual Stacked and Dual ParallelMicron512Mb3.3V
Vivado** / ISE 14.7(patch)2013.04
Quad Mode - Single, Dual Stacked and Dual ParallelMicron1024Mb3.3V
Vivado** / ISE 14.7(patch)2013.04
Quad Mode - Single, Dual Stacked and Dual ParallelMicron128 Mb1.8V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron128 Mb3.3V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron256Mb1.8V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron256Mb3.3V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron512Mb1.8V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron512Mb3.3V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron1 Gb1.8V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron1 Gb3.3V
Vivado**xilinx-v2015.2.01
Quad Mode - Single, Dual Stacked and Dual ParallelMicron2 Gb1.8V
Vivado**xilinx-v2018.1
Quad Mode - Single, Dual Stacked and Dual ParallelMicron2 Gb3.3V
Vivado**xilinx-v2018.1
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion32Mb3.3VNot Recommended.
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion64Mb
Vivado**xilinx-v2019.1
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion64Mb3.3VNot Recommended.
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion128 Mb1.8V/3.3V
Vivado** / ISE 14.42013.04Not Recommended for New Designs.Recommend using the S25FL127S or S25FL128S for all new designs
Quad Mode - SingleSpansion128 Mb1.8V/3.3V
Vivado** / ISE 14.42013.04
Quad Mode - Dual Stacked and Dual ParallelSpansion128 Mb1.8V/3.3V
Vivado** / ISE 14.7(patch)2013.04
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion128 Mb3.3V
Vivado**xilinx-v2015.2.01
Spansion128 Mb1.8VThe Spansion S25FS family does not support Dual Out (0x3B) and Quad Out (0x6B) read commands
四模式 – 双堆叠Spansion128 Mb1.8VThe Spansion S25FS family does not support Dual Out (0x3B) and Quad Out (0x6B) read commands
Quad Mode - Dual ParallelSpansion128 Mb1.8VThe Spansion S25FS family does not support Quad Out (0x6B) read, necessary for Dual Parallel
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion256Mb1.8V/3.3V
Vivado** / ISE 14.7(patch)2013.04
Quad Mode - Single, Dual Stacked and Dual ParallelSpansion512Mb3.3V
Vivado** / ISE 14.7(patch)2013.04
四模式 – 双堆叠Spansion1024Mb3.3V
Vivado** / ISE 14.7(patch)2013.04This part is two 512 Mb dies in a single package (Dual Stacked).
Quad Mode - SingleSpansion1024Mb1.8VFour byte address mode or four byte address commands are required to access memory locations above the first 128 Mbits (16MBytes).
Quad Mode - Single, Dual Stacked and Dual ParallelMacronix256Mb3.3V
Vivado**xilinx-v2015.2.012015.3 FSBL and earlier requires modifications.
Quad Mode - Single, Dual Stacked and Dual ParallelMacronix512Mb1.8V/3.3V
Vivado**xilinx-v2019.1In 2019.1 a patch is required.
Quad Mode - Single, Dual Stacked and Dual ParallelMacronix512Mb3.3V
Vivado**2015.3 FSBL  and earlier requires modifications.
Quad Mode - Single, Dual Stacked and Dual ParallelMacronix1024Mb3.3V
Vivado**xilinx-v2018.3
Quad Mode - Single, Dual Stacked and Dual ParallelMacronix2048Mb1.8V/3.3V
Vivado**xilinx-v2019.1In 2019.1 a patch is required.
Quad Mode - Single, Dual Stacked and Dual ParallelWinbond128 Mb3.3V
Vivado** / ISE 14.7(patch)2013.07
Quad Mode - Single, Dual Stacked and Dual ParallelWinbond128 Mb2013.07

For Automotive and Industrial Plus Grades: Meet hold timing (tHOmin=0ns) only with Feedback Clock Disabled (QSPICLK < 40MHz).

Quad Mode - Single, Dual Stacked and Dual ParallelISSI64Mb3.3V2013.07
Quad Mode - Single and Dual StackedISSI128 Mb1.8V/3.3VVivado**xilinx-v2019.1
Quad Mode - Dual ParallelISSI128 Mb1.8V/3.3VFAST READ QUAD OUTPUT (0x6B) is NOT supported.
Quad Mode - Single, Dual Stacked and Dual ParallelISSI512 Mb1.8V/3.3VVivado**xilinx-v2019.1

 

* 2013.04 is the U-Boot release number (U-Boot from April, 2013), not the Xilinx tool release.

** Xilinx Tools indicate the ISE (iMPACT) version.

*** A patch to ISE14.7 and SDK 2013.3 may be required to program these flash devices in iMPACT and SDK.

The same patch works for both.

敬请参阅 (Xilinx 答复 59275)



NAND

Benefits of NAND:

  • High Memory density - NAND is an inexpensive solution for large density devices.

Downsides of NAND:

  • Lower device performance - Maximum bandwidth is less than QSPI.
  • High pin count - NAND devices require more pins than QSPI.
  • Difficult Management - NAND devices are hard to manage.Bad blocks are a regular concern which require design decisions on how bad blocks will be managed for a particular system setup.

注:

Only On-Die ECC and 1-bit ECC NAND devices can be used with Zynq-7000 SoC.

  • In order to use On-Die ECC with Zynq-7000 SoC, the flash MUST be a MICRON and MUST support bit 3 (Enable/Disable ECC) in Feature Address 90h.

仅选择 1 个芯片的 NAND 器件可以与 Zynq-7000 SoC 一起使用。

供应商

供应商 NAND Flash Families
On-Die ECC
S34

Micron on-die ECC NAND

Micron NAND devices typically require multi-bit ECC, which necessitates using only devices with on-die ECC support.请查看特定的数据手册,以了解有关片上 ECC 支持的信息。

Configuration and Specifications

MIO Pins
15
23


Xilinx Supported Devices

Mode供应商Flash DensityVoltage****Feature Set
Xilinx Tool**U-Boot*Notes
x8Micron1 Gb1.8/3.3VDIncompatible
on-DIE ECC but missing required bit 3 (enable ECC) in Feature Address 90h because this is a factory-enabled on-die ECC device.
x8Micron1 Gb1.8/3.3VDon-DIE ECC but missing required bit 3 (enable ECC) in Feature Address 90h because this is a factory-enabled on-die ECC device.
x8,x16Micron1 Gb1.8/3.3VD已知的适用领域


片上 ECC
x16Micron1 Gb1.8/3.3VE

Requires > 1-bit ECC (No on-DIE)
x8,x16Micron2 Gb1.8/3.3VE
Vivado** / ISE 14.42013.04片上 ECC
x8Micron2 Gb3.3VG
Vivado**2020.1片上 ECC
x8,x16Micron2 Gb1.8/3.3VFRequires > 1-bit ECC (No on-DIE)
x8,x16Micron4 Gb1.8/3.3VD片上 ECC
x8Micron8 Gb1.8/3.3VD片上 ECC
x8Micron8 Gb1.8/3.3VBRequires > 1-bit ECC (No on-DIE)
x8Micron16 Gb3.3VD需要 2 CS
x8Spansion1 Gb3.3V
Vivado**需要 1 位 ECC
x8Spansion1 Gb3.3V需要 2 位 ECC
x8,x16Spansion2 Gb3.3V
Vivado**需要 1 位 ECC
x8Spansion4 Gb3.3V
ISE 14.72013.04
需要 1 位 ECC
x8Spansion4 Gb3.3V需要 2 位 ECC
x8Spansion8 Gb3.3V需要 1 位 ECC
x8Spansion8 Gb3.3V需要 2 CS


* 2013.04 is the U-Boot release number (U-Boot from April, 2013), not the Xilinx tool release.

** Xilinx Tools indicate the ISE (iMPACT) version.

NOR

Benefits of NOR:

  • Easy management - NOR can be accessed as linear memory in Zynq devices.In addition, bad blocks are not as much of a concern as, for example, NAND.

Downsides of NOR:

  • High pin count - NOR requires nearly all of the 54 MIO pins.
  • Low Density - NOR density is comparable to QSPI.

供应商

供应商 NOR Flash Families
M29EW


Configuration and Specifications

MIO PinsMax Memory Size
4064 MB


Xilinx Supported Devices

Mode供应商Flash DensityVoltage

Xilinx Tool **

U-Boot*
---Micron512Mb3.3V
Vivado** / ISE 14.72013.04
---Micron256Mb3.3V
Vivado** / ISE 14.42013.04
---Micron128 Mb3.3V
Vivado** / ISE 14.42013.04
---Micron64Mb3.3V
Vivado** / ISE 14.42013.04
---Micron32Mb3.3V
Vivado** / ISE 14.42013.04


* 2013.04 is the U-Boot release number (U-Boot from April, 2013), not the Xilinx tool release.

** Xilinx Tools indicate the ISE (iMPACT) version.

The Zynq-7000 SoC is expected to work with eMMC devices because the protocol is the same as SD, but this has not been extensively verified.

Users must be careful to meet all timing requirements as they might or might not comply with eMMC.

Benefits of SD:

  • High density - SD has densities comparable to NAND.
  • Easy Management - Device is generally managed as a file system.Bad blocks do not need to be managed in the user design.

Downsides of SD:

  • Slow performance - SD is slower than QSPI
  • Mechanical considerations - SD cards require a connector.

MIO PinsMax Memory Size
6

Any Size

链接问答记录

主要问答记录

Answer Number 问答标题 问题版本 已解决问题的版本
52538 Zynq-7000 SoC - Boot and Configuration N/A N/A

相关答复记录

AR# 50991
日期 05/01/2020
状态 活跃
Type 一般类
器件
Tools
IP
Boards & Kits