TE0715-05-21C33-A
The Trenz Electronic TE0715-05-21C33-A is a SoC module integrating a AMD Zynq Z 7012S with 4 MGT Links, a Gigabit Ethernet transceiver (physical layer), 1 GByte DDR3L SDRAM with 32-bit width, 32 MByte SPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.
This device contains a single-core ARM Cortex-A9 processor and represents the lowest cost entry point to the scalable Zynq 7000 platform.
All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.
There are different base boards and a cooling solution available for this module. Latest documentation, design support files and reference designs with source files are available for download free of charge.
All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
主要特性与优势
- AMD Zynq XC7Z012S-1CLG485C
- Single-Core ARM Cortex-A9 MPCore up to 766MHz
- 10/100/1000 tri-speed gigabit Ethernet transceiver (PHY) with SGMII
- MAC Address EEPROM
- USB 2.0 high-speed ULPI transceiver
- 32 MByte QSPI Flash memory (with XiP support)
- 1 GByte 32-Bit DDR3L SDRAM
- Programmable Clock Generator: Transceiver Clock (default 125 MHz)
- 132 FPGA I/O's (65 LVDS pairs possible) and 14 PS-MIO available on board-to-board connectors
- 4 GTP/GTX Tranceivers
- Temperature compensated RTC (real-time clock)
- System management
- Rugged for shock and high vibration
- eFUSE bit-stream encryption and AES bit-stream encryption
包裝內容物含配件
- Other assembly options for cost or performance optimization plus high volume prices available on request.