技术支持

Xilinx support accelerates customer productivity and time-to-market from system development to product end-of-life.

概述

Xilinx support accelerates customer productivity and time-to-market from system development to product end-of-life.

Xilinx has a long legacy of delivering products and services that accelerate the customer design process.Customers have access to an infrastructure that is continuously tuned-to-target defect-free product experiences.While this initiative takes a tremendous level of focus and partnership, the rewards have been extraordinary.

Xilinx has proven repeatedly that structured customer collaborations with high-volume customer applications can achieve levels close to, or at, zero PPM.This disciplined approach creates synergy between Xilinx and customers through joint-design reviews, design evaluation samples, and focused teamwork.These collaborative efforts often extend to provide contract manufacturers with customer engineering support.By working with Xilinx, designers can enjoy superior results through:

  • Defect avoidance through collaborative knowledge sharing (training and tutorials) and design reviews
  • Better customer experiences with debug tools (including access to design evaluation samples)
  • Improved customer design methodologies through the introduction of Vivado™ design-rule-checks (DRCs) and a new handbook focused on design methodologies
  • Fewer RMAs through improved development tool quality
航空
Xilinx 推出商业、工业、军用和宇航级产品,满足航空航天和军用产品产业的需要。
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汽车
Xilinx 汽车(XA)是一种可编程引擎,适于当今的很多信息娱乐、驾驶员辅助和驾驶员信息系统,以及未来的新一代系统。
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数据中心
数据中心设计用于高带宽、低延迟的服务器、网络和存储,可实现更高价值的云服务.
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高性能计算
工艺技术和器件架构的进步使 Xilinx FPGA 可用于高性能计算(HPC)应用。
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工业
Xilinx 平台和解决方案可提供各种性能和系统集成层次,它与传统微处理器、DSP 和 ASIC 相比,能够为工厂自动化和工业成像应用提供更加卓越的功能。
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消费类电子
消费电子市场的需求与动态不断发展变化。
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2D Barcode

2D Barcode Traceability

Every Xilinx device has a unique 2D barcode linked to its DNA which contains historical data for traceability from wafer to POS (Point-of-Sale).

This 2D barcode enables advanced data analytics through AI / Machine Learning to:

  • Enhance operations agility
  • Improve quality
  • Increase yield
  • Faster on-time product delivery
  • Increase customer productivity

2d-barcode
Customer Support

Worldwide Customer Support

Xilinx sales offices, representatives and authorized distributors around the world are available to support customers.

  • Technical information is available online 24 hours a day from the Support website
  • Technical Support staff are available to respond to your questions in the Community Forums
  • Individual assistance from Xilinx Technical Support may be available through Service Portal

quality-customer-support
Failure Analysis

Failure Analysis (FA) Capability

Xilinx and customers—with support from technology suppliers and partners—make-up a tightly linked community.The entire ecosystem must succeed to drive-up the quality of the end-solutions enabled by Xilinx innovations.Periodic quality scorecards provided by customers are therefore the true measure of Xilinx quality.

Fault-isolation and failure-analysis enable our engineering to determine the cause of an issue by scripts, patterns, tools, simulations and other diagnostic methodologies.These electrical-fault diagnostic methods can pinpoint the exact cause and location of the failing circuit.Our failure analysis labs process, collect and analyze data to determine the cause of the failure.Physical inspection of the fault-isolated location in the silicon are mostly the stages during failure analysis.It is a subsequent examination of the cause or cause-of-failure using a wide array of methods, especially microscopy and spectroscopy.Additional Xilinx customer-facing quality hallmarks include:

  • Closed-loop focus on root cause
  • On-line RMA real-time and on-line customer support tool
  • Full 8D root-cause analysis and corrective action leading to continuous improvements
  • Executive commitment to improving customer satisfaction

Our zero-defect strategy and exceeding industry reliability benchmark is working and we expect to improve even further with continuous improvement.

In case any defect is found, Xilinx will relentless drive to discover root-causes of failures.Xilinx has advanced tools capable of analyzing the latest technology nodes beyond 16nm, where even a few micro-amps of current leakage can be detected.

quality-fa
Change Management

Change Management

Xilinx qualifies products and processes prior to production release.Xilinx 产品的设计、制造、测试变更或淘汰方面的信息依照已有的行业标准进行传播。

Xilinx uses JEDEC (JESD46 / PCN and JESD48 / PDN) standards, as the foundation for our customer notification processes related to change or obsolescence.该流程由延伸至 Xilinx 供应链的变更管理基础架构来支持。

Xilinx communicates through XCN Notifications (Product Change Notice / PCN and Product Discontinuation Notice / PDN) which are posted on Xilinx.com.

  • Customers will be notified a minimum of 90 days before the proposed ship date of the production identified in the PCN.Lack of acknowledgement of the PCN within 30 days constitutes acceptance of the change.
  • Customers will be allowed a minimum of 12 months from the PDN notice to place final orders, and 6 months from the notice for final shipments.

Customer needing notification for changes and obsolescence are required to register on Xilinx.com.立即注册,并对 “Alerts” 部分进行设置,以包含客户通知。

Product Longevity

Product Longevity

A product lifecycle is typically defined by four main phases: introduction, growth, maturity, and decline.

Xilinx designs products and creates the supporting supply chain with the clear intent to support a minimum 15+ year lifecycle*, starting from first production release.Xilinx parts are used extensively in numerous applications that require a long operational lifetime, and therefore, Xilinx makes a strong commitment to product longevity.With this commitment, although the minimum lifecycle is 15 years, customers will see that the majority of families will be supported much longer.The longevity of Xilinx products is longer than ASSPs, ASICs, and other major FPGA suppliers.

In the case of a last time buy, Xilinx does follow the JEDEC standard

*Does not apply to boards or products with in-package high bandwidth memory DRAM